Hydrogen-induced crystallization of amorphous silicon thin films. I. Simulation and analysis of film postgrowth treatment with H 2 plasmas
We present a detailed atomic-scale analysis of the postdeposition treatment of hydrogenated amorphous silicon ( a - Si : H ) thin films with H 2 plasmas. The exposure of a - Si : H films to H atoms from a H 2 plasma was studied through molecular-dynamics (MD) simulations of repeated impingement of H...
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Veröffentlicht in: | Journal of applied physics 2006-09, Vol.100 (5), p.053514-053514-11 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | We present a detailed atomic-scale analysis of the postdeposition treatment of hydrogenated amorphous silicon
(
a
-
Si
:
H
)
thin films with
H
2
plasmas. The exposure of
a
-
Si
:
H
films to H atoms from a
H
2
plasma was studied through molecular-dynamics (MD) simulations of repeated impingement of H atoms with incident energies ranging from
0.04
to
5.0
eV
. Structural and chemical characterizations of the H-exposed
a
-
Si
:
H
films was carried out through a detailed analysis of the evolution of the films' Si-Si pair correlation function, Si-Si-Si-Si dihedral angle distribution, structural order parameter, Si-H bond length distributions, as well as film surface composition. The structural evolution of the
a
-
Si
:
H
films upon exposure to H atoms showed that the films crystallize to form nanocrystalline silicon at temperatures over the range of
500
-
773
K
, i.e., much lower than those required for crystallization due to thermal annealing. The MD simulations revealed that during H exposure of
a
-
Si
:
H
the reactions that occur include surface H adsorption, surface H abstraction, etching of surface silicon hydrides, dangling-bond-mediated dissociation of surface hydrides, surface H sputtering/desorption, diffusion of H into the
a
-
Si
:
H
film, and insertion of H into strained Si-Si bonds. |
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ISSN: | 0021-8979 1089-7550 |
DOI: | 10.1063/1.2229426 |