Interface-engineering studies on the photoelectric properties and stability of the CsSnI-SnS heterostructure
The stability of Sn-based perovskites has always been the main obstacle to their application. Interface engineering is a very effective method for improving the stability of perovskites and the efficiency of batteries. Two-dimensional (2D) monolayer SnS is selected as a surface-covering layer for th...
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Veröffentlicht in: | Physical chemistry chemical physics : PCCP 2022-10, Vol.24 (39), p.24123-24129 |
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Zusammenfassung: | The stability of Sn-based perovskites has always been the main obstacle to their application. Interface engineering is a very effective method for improving the stability of perovskites and the efficiency of batteries. Two-dimensional (2D) monolayer SnS is selected as a surface-covering layer for the CsSnI
3
lead-free perovskite. The structure, electronic properties, and stability of the CsSnI
3
-SnS heterostructure are studied using density functional theory. Due to the different contact interfaces (SnI
2
and CsI interfaces) of CsSnI
3
, the interface electronic-transmission characteristics are inconsistent in the CsSnI
3
-SnS heterostructure. Because of the difference in work functions, electrons flow at the interface of the heterostructure, forming a built-in electric field. The heterostructures form a type-I energy-level arrangement. Under the action of an electric field in the CsI-SnS heterostructure, electrons at the CsI interface recombine with holes at the SnS interface; however, the holes of the SnI
2
interface and the electrons of the SnS interface are easily recombined in the SnI
2
-SnS heterostructure. Moreover, monolayer SnS can enhance the light absorption of the CsSnI
3
-SnS heterostructure. Monolayer SnS can inhibit the migration of iodine ions and effectively improve the structural stability of the SnI
2
-SnS interface heterostructure. This work provides a new theoretical basis for improving the stability of lead-free perovskites.
The stability of Sn-based perovskites has always been the main obstacle to their application. |
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ISSN: | 1463-9076 1463-9084 |
DOI: | 10.1039/d2cp02742a |