Improved performance of a conducting-bridge random access memory using ionic liquids
The conducting-bridge random access memory (CB-RAM) is a promising candidate for the next-generation memory. In this study, the addition effect of 18 types of ionic liquids (ILs) on the performances of the Cu/HfO 2 /Pt type CB-RAM has been investigated; the switching voltage was lowered by supplying...
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Veröffentlicht in: | Journal of materials chemistry. C, Materials for optical and electronic devices Materials for optical and electronic devices, 2016-01, Vol.4 (3), p.7215-7222 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The conducting-bridge random access memory (CB-RAM) is a promising candidate for the next-generation memory. In this study, the addition effect of 18 types of ionic liquids (ILs) on the performances of the Cu/HfO
2
/Pt type CB-RAM has been investigated; the switching voltage was lowered by supplying a trace amount of the IL to the HfO
2
layer of the Cu/HfO
2
/Pt cell. It was revealed that the ionic conductivity (
σ
i
) of the IL and the coordinating ability (
β
) of the anion in the IL towards the copper (Cu) ion are key competing factors that determine the voltage required for the formation of the Cu filament (
V
set
); the increase in
σ
i
and the decrease in
β
are effective in enhancing the ionization and diffusion of the Cu atoms, resulting in the reduction of
V
set
. Therefore, among the tested ILs, 1-butyl-3-methylimidazolium bis(trifluoromethanesulfonyl)amide ([bmim][Tf
2
N]), 1-ethyl-3-methylimidazoliumbis(trifluoromethanesulfonyl)amide ([emim][Tf
2
N]) and 1-butyl-3-methylimidazolium bis(fluorosulfonyl)amide ([bmim][FSA]), which have high
σ
i
and low
β
values were found to be the best additives for the Cu/HfO
2
/Pt cell. On the other hand, reset was revealed to occur due to the rupture of the Cu filament by the thermal diffusion of the Cu atoms by Joule heat. Reducing
V
set
and making a thin filament are effective in reducing the reset voltages. We further traced the origin of the improved dispersion of the switching voltages by the addition of the Cu(Tf
2
N)
2
doped [bmim][Tf
2
N] to the HfO
2
film, which we recently reported. A complex-impedance measurement suggested that the addition of Cu doped IL involves two competing factors: the decline of the Cu ion diffusion and enhancement of the Cu ionization. The balance of these two factors determines the important parameters such as
V
set
and its dispersion. The performance of the CB-RAM can be optimized by the adjustment of the IL, considering the balance of the competing factors revealed by the present study.
The conducting-bridge random access memory (CB-RAM) is a promising candidate for the next-generation memory. |
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ISSN: | 2050-7526 2050-7534 |
DOI: | 10.1039/c6tc01486k |