Conductive polymer nanocomposites with hierarchical multi-scale structures via self-assembly of carbon-nanotubes on graphene on polymer-microspheresElectronic supplementary information (ESI) available. See DOI: 10.1039/c3nr06056j
A novel and highly conductive 3-dimensional (3D) hierarchical multi-scale structure is formed by a new, simple, facile, and water-based method that enables practical production of conductive carbon nanofiller/polymer composites. More specifically, the π-π interaction between CNTs and graphene oxide...
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Sprache: | eng |
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Zusammenfassung: | A novel and highly conductive 3-dimensional (3D) hierarchical multi-scale structure is formed by a new, simple, facile, and water-based method that enables practical production of conductive carbon nanofiller/polymer composites. More specifically, the π-π interaction between CNTs and graphene oxide (GO) is exploited to disperse conductive but non-polar CNTs with amphiphilic GO sheets to form a stable aqueous colloidal solution. Aqueous-dispersible latex-polystyrene microspheres are then added to enable the self-assembly processes of anchoring CNTs on GO and wrapping microspheres with GO-stabilized CNTs for the formation of an intriguing 3D hierarchical multi-scale structure. During this process, GO is reduced to conductive reduced-graphene oxide (RGO). The resultant RGO sheets act as "nano-walls" to prevent CNTs from randomly diffusing into the polymer bulk during thermal pressing of RGO-CNT/microspheres, which results in the formation of a 3D foam-like network of RGO-CNTs with high quality. The resultant composite with such a structure gives an ultra-low percolation threshold (0.03 vol% RGO-CNTs) and a reasonably high conductivity (153 S m
−1
at 4 vol% RGO-CNTs), which could satisfy various applications requiring both transparency and electrical conduction characteristics (
e.g.
transparent antistatic coatings, capacitive touch-screens, and transparent electronic devices).
GO is employed to disperse CNTs and direct their assembly on polystyrene microspheres to form a 3D hierarchical conducting network. |
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ISSN: | 2040-3364 2040-3372 |
DOI: | 10.1039/c3nr06056j |