Substitution of copper atoms into defect-rich molybdenum sulfides and their electrocatalytic activity

Studies on intercalation or substitution of atoms into layered two-dimensional (2D) materials are rapidly expanding and gaining significant consideration due to their importance in electronics, catalysts, batteries, sensors, etc. In this manuscript, we report a straightforward method to create sulph...

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Veröffentlicht in:Nanoscale advances 2021-03, Vol.3 (6), p.1747-1757
Hauptverfasser: Wang, Zixing, Kannan, Harikishan, Su, Tonghui, Swaminathan, Jayashree, Shirodkar, Sharmila N, Robles Hernandez, Francisco C, Benavides, Hector Calderon, Vajtai, Robert, Yakobson, Boris I, Meiyazhagan, Ashokkumar, Ajayan, Pulickel M
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Sprache:eng
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Zusammenfassung:Studies on intercalation or substitution of atoms into layered two-dimensional (2D) materials are rapidly expanding and gaining significant consideration due to their importance in electronics, catalysts, batteries, sensors, etc. In this manuscript, we report a straightforward method to create sulphur (S) deficient molybdenum (Mo) sulfide (MoS 2− x ) structures and substitute them with zerovalent copper (Cu) atoms using a colloidal synthesis method. The synthesized materials were studied using several techniques to understand the proportion and position of copper atoms and the effect of copper functionalization. Specifically, the impact of change in the ratio of Cu : S and the hydrogen evolution reaction (HER) activity of the derived materials were evaluated. This technique paves the way for the synthesis of various functionalized 2D materials with a significant impact on their physical and chemical behavior making them potential candidates for catalysis and several other applications such as energy storage and the development of numerous functional devices. Colloidal technique was used to synthesize copper atom substituted molybdenum sulfides and used as a catalyst. The derived materials were characterized using several analytical methods and revalidated using DFT calculations.
ISSN:2516-0230
2516-0230
DOI:10.1039/d0na01064b