Texture Evolution and Nanohardness in Cu-Nb Composite Wires

Multifilamentary microcomposite copper-niobium (Cu-Nb) wires were fabricated by a series of accumulative drawing and bonding steps (ADB). The texture of the Cu matrix in these wires was studied using electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM). Dynamic recrys...

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Veröffentlicht in:	Materials 2021-09, Vol.14 (18), p.5294
Hauptverfasser:	Xiang, Shihua, Yang, Xiaofang, Liang, Yanxiang, Wang, Lu
Format:	Artikel
Sprache:	eng
Schlagworte:	Cold drawing Copper Deformation Dynamic recrystallization Electron backscatter diffraction Grain size Interfaces Investigations Mechanical properties Nanohardness Nanoindentation Niobium Texture True strain
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