Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (

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Bibliographische Detailangaben
Veröffentlicht in:Materials 2021-06, Vol.14 (12), p.3353
Hauptverfasser: Makrygianni, Marina, Zacharatos, Filimon, Andritsos, Kostas, Theodorakos, Ioannis, Reppas, Dimitris, Oikonomidis, Nikolaos, Spandonidis, Christos, Zergioti, Ioanna
Format: Artikel
Sprache:eng
Schlagworte:
Assembly
Cameras
Circuit boards
Circuits
Deposition
Electronic components
Experiments
Form factors
High resolution
Lasers
Lead free
Light emitting diodes
Microparticles
Micropatterning
Nanoparticles
Printed circuits
Printing
Radio frequency identification
Soldering
Solders
Stability
Substrates
Thickness
Viscosity
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Beschreibung
Zusammenfassung:Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (
ISSN:1996-1944
1996-1944
DOI:10.3390/ma14123353