Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface
Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO 2 would...
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Veröffentlicht in: | Scientific reports 2018-01, Vol.8 (1), p.1391-10, Article 1391 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
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Zusammenfassung: | Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO
2
would be a key to synthesize a dangling-bond-free GaN/SiO
2
interface. Here, we predict that a silicon oxynitride (Si
4
O
5
N
3
) layer can epitaxially grow on a GaN(0001) surface without creating dangling bonds at the interface. Our
ab initio
calculations show that the GaN/Si
4
O
5
N
3
structure is more stable than silicon-oxide-terminated GaN(0001) surfaces. The electronic properties of the GaN/Si
4
O
5
N
3
structure can be tuned by modifying the chemical components near the interface. We also propose a possible approach to experimentally synthesize the GaN/Si
4
O
5
N
3
structure. |
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ISSN: | 2045-2322 2045-2322 |
DOI: | 10.1038/s41598-018-19283-4 |