Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface

Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO 2 would...

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Veröffentlicht in:Scientific reports 2018-01, Vol.8 (1), p.1391-10, Article 1391
Hauptverfasser: Nishio, Kengo, Yayama, Tomoe, Miyazaki, Takehide, Taoka, Noriyuki, Shimizu, Mitsuaki
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Sprache:eng
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Zusammenfassung:Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO 2 would be a key to synthesize a dangling-bond-free GaN/SiO 2 interface. Here, we predict that a silicon oxynitride (Si 4 O 5 N 3 ) layer can epitaxially grow on a GaN(0001) surface without creating dangling bonds at the interface. Our ab initio calculations show that the GaN/Si 4 O 5 N 3 structure is more stable than silicon-oxide-terminated GaN(0001) surfaces. The electronic properties of the GaN/Si 4 O 5 N 3 structure can be tuned by modifying the chemical components near the interface. We also propose a possible approach to experimentally synthesize the GaN/Si 4 O 5 N 3 structure.
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-018-19283-4