Enhanced dielectric properties of poly(vinylidene fluoride) composites filled with nano iron oxide-deposited barium titanate hybrid particles

We report enhancement of the dielectric permittivity of poly(vinylidene fluoride) (PVDF) generated by depositing magnetic iron oxide (Fe 3 O 4 ) nanoparticles on the surface of barium titanate (BT) to fabricate BT–Fe 3 O 4 /PVDF composites. This process introduced an external magnetic field and the...

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Veröffentlicht in:Scientific reports 2016-09, Vol.6 (1), p.33508-33508, Article 33508
Hauptverfasser: Zhang, Changhai, Chi, Qingguo, Dong, Jiufeng, Cui, Yang, Wang, Xuan, Liu, Lizhu, Lei, Qingquan
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Sprache:eng
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Zusammenfassung:We report enhancement of the dielectric permittivity of poly(vinylidene fluoride) (PVDF) generated by depositing magnetic iron oxide (Fe 3 O 4 ) nanoparticles on the surface of barium titanate (BT) to fabricate BT–Fe 3 O 4 /PVDF composites. This process introduced an external magnetic field and the influences of external magnetic field on dielectric properties of composites were investigated systematically. The composites subjected to magnetic field treatment for 30 min at 60 °C exhibited the largest dielectric permittivity (385 at 100 Hz) when the BT–Fe 3 O 4 concentration is approximately 33 vol.%. The BT–Fe 3 O 4 suppressed the formation of a conducting path in the composite and induced low dielectric loss (0.3) and low conductivity (4.12 × 10 −9  S/cm) in the composite. Series-parallel model suggested that the enhanced dielectric permittivity of BT–Fe 3 O 4 /PVDF composites should arise from the ultrahigh permittivity of BT–Fe 3 O 4 hybrid particles. However, the experimental results of the BT–Fe 3 O 4 /PVDF composites treated by magnetic field agree with percolation theory, which indicates that the enhanced dielectric properties of the BT–Fe 3 O 4 /PVDF composites originate from the interfacial polarization induced by the external magnetic field. This work provides a simple and effective way for preparing nanocomposites with enhanced dielectric properties for use in the electronics industry.
ISSN:2045-2322
2045-2322
DOI:10.1038/srep33508