Multi-scale numerical simulations of thermal expansion properties of CNT-reinforced nanocomposites

In this work, the thermal expansion properties of carbon nanotube (CNT)-reinforced nanocomposites with CNT content ranging from 1 to 15 wt% were evaluated using a multi-scale numerical approach, in which the effects of two parameters, i.e., temperature and CNT content, were investigated extensively....

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Veröffentlicht in:Nanoscale research letters 2013-01, Vol.8 (1), p.15-15, Article 15
Hauptverfasser: Alamusi, Hu, Ning, Qiu, Jianhui, Li, Yuan, Chang, Christiana, Atobe, Satoshi, Fukunaga, Hisao, Liu, Yaolu, Ning, Huiming, Wu, Liangke, Li, Jinhua, Yuan, Weifeng, Watanabe, Tomonori, Yan, Cheng, Zhang, Yajun
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Sprache:eng
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Zusammenfassung:In this work, the thermal expansion properties of carbon nanotube (CNT)-reinforced nanocomposites with CNT content ranging from 1 to 15 wt% were evaluated using a multi-scale numerical approach, in which the effects of two parameters, i.e., temperature and CNT content, were investigated extensively. For all CNT contents, the obtained results clearly revealed that within a wide low-temperature range (30°C ~ 62°C), thermal contraction is observed, while thermal expansion occurs in a high-temperature range (62°C ~ 120°C). It was found that at any specified CNT content, the thermal expansion properties vary with temperature - as temperature increases, the thermal expansion rate increases linearly. However, at a specified temperature, the absolute value of the thermal expansion rate decreases nonlinearly as the CNT content increases. Moreover, the results provided by the present multi-scale numerical model were in good agreement with those obtained from the corresponding theoretical analyses and experimental measurements in this work, which indicates that this multi-scale numerical approach provides a powerful tool to evaluate the thermal expansion properties of any type of CNT/polymer nanocomposites and therefore promotes the understanding on the thermal behaviors of CNT/polymer nanocomposites for their applications in temperature sensors, nanoelectronics devices, etc.
ISSN:1931-7573
1556-276X
1556-276X
DOI:10.1186/1556-276X-8-15