An Effective Lift-Off Method for Patterning High-Density Gold Interconnects on an Elastomeric Substrate

High‐resolution, high‐density gold interconnects are effectively patterned on an elastomeric substrate. A 3 cm cable of ten gold wires with 10 μm width and 20 μm pitch is achieved, successfully demonstrating density increases of more than one order of magnitude from previously established work. Many applications in the fields of stretchable electronics and conformable neural interfaces will benefit from these fabrication developments.