Concentrated Ionic Fluids: Is There a Difference Between Chloride‐Based Brines and Deep Eutectic Solvents?
Deep Eutectic Solvents (DESs) have been lauded as novel solvents, but is there really a difference between them and concentrated aqueous brines? They provide a method of adjusting the activity of water and chloride ions which can affect mass transport, speciation and reactivity. This study proposes...
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Veröffentlicht in: | Angewandte Chemie International Edition 2023-11, Vol.62 (46), p.e202311140-n/a |
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Sprache: | eng |
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Zusammenfassung: | Deep Eutectic Solvents (DESs) have been lauded as novel solvents, but is there really a difference between them and concentrated aqueous brines? They provide a method of adjusting the activity of water and chloride ions which can affect mass transport, speciation and reactivity. This study proposes a continuum of properties across concentrated ionic fluids and uses metal processing as an example. Charge transport is shown to be governed by fluidity and there is no discontinuity between molar conductivity and fluidity irrespective of cation, charge density or ionic radius. Diffusion coefficients of iron(III) and copper(II) chloride in numerous concentrated ionic fluids show the same linear correlation between diffusion coefficient and fluidity. These oxidising agents were used to etch copper, silver and nickel and while the etching rate increased with fluidity for copper, etching of silver and nickel only occurred at high chloride and low water activity as passivation occurred when water activity increased. Overall, brines provide a high chloride content at a lower viscosity than DESs, but unlike DESs, brines are unable to prevent passivation due to their high water content. The results show how selective etching of mixed metal waste streams can be achieved by tuning chloride and water activity.
Conductivity, viscosity, water, and chloride content were measured for brines and aqueous DESs. Low viscosity brines favour copper etching due to higher mass transport. Low water content DESs promote etching for silver and nickel. |
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ISSN: | 1433-7851 1521-3773 |
DOI: | 10.1002/anie.202311140 |