A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates
The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies....
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Veröffentlicht in: | Polymers 2023-09, Vol.15 (19), p.3895 |
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Format: | Artikel |
Sprache: | eng |
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