A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies....

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Veröffentlicht in:Polymers 2023-09, Vol.15 (19), p.3895
Hauptverfasser: Nimbalkar, Pratik, Bhaskar, Pragna, Kathaperumal, Mohanalingam, Swaminathan, Madhavan, Tummala, Rao R
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Sprache:eng
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