Reductive Thermal Atomic Layer Deposition Process for Gold

In this work, we developed an atomic layer deposition (ALD) process for gold metal thin films from chloro­(triethylphosphine)­gold­(I) [AuCl­(PEt3)] and 1,4-bis­(trimethylgermyl)-1,4-dihydropyrazine [(Me3Ge)2DHP]. High purity gold films were deposited on different substrate materials at 180 °C for the first time with thermal reductive ALD. The growth rate is 1.7 Å/cycle after the film reaches full coverage. The films have a very low resistivity close to the bulk value, and a minimal amount of impurities could be detected. The reaction mechanism of the process is studied in situ with a quartz crystal microbalance and a quadrupole mass spectrometer.