Hierarchical NiCo 2 O 4 @CuS composite electrode with enhanced surface area for high-performance hybrid supercapacitors

Hierarchical binder-free NiCo O @CuS composite electrodes have been successfully fabricated on a nickel foam surface using a facile hydrothermal method and directly used as a battery-type electrode material for supercapacitor applications. The surface morphological studies reveal that the composite...

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Veröffentlicht in:RSC advances 2024-12, Vol.14 (54), p.40087
Hauptverfasser: Muralee Gopi, Chandu V V, Kulurumotlakatla, Dasha Kumar, Raghavendra, K V G, Suneetha, Maduru, Ramesh, R
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Sprache:eng
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Zusammenfassung:Hierarchical binder-free NiCo O @CuS composite electrodes have been successfully fabricated on a nickel foam surface using a facile hydrothermal method and directly used as a battery-type electrode material for supercapacitor applications. The surface morphological studies reveal that the composite electrode exhibited porous NiCo O nanograss-like structures with CuS nanostructures. The surface area of the composite is significantly enhanced (91.38 m g ) compared to NiCo O (52.16 m g ), with a predominant pore size of 3-6 nm. This synergistic combination enhanced the electrode's electrochemical properties. The NiCo O @CuS electrode delivered an impressive specific capacitance of 141.13 mA h g at 1 A g , surpassing the performance of the bare NiCo O electrode. The composite electrode also exhibited excellent rate capability and cycling stability, retaining 87.49% of its initial capacity at high current densities and 88.62% after 3000 cycles. A hybrid supercapacitor (HSC) device assembled using NiCo O @CuS and G-ink electrodes attained a peak energy density of 28.85 W h kg at a power density of 238.2 W kg , outperforming many reported HSCs. Additionally, the HSC device demonstrated exceptional cycling stability, retaining 87.59% of its initial capacitance after 4000 cycles. The superior performance of the NiCo O @CuS composite electrode is attributed to the synergistic combination of NiCo O and CuS, which promotes interfacial electron separation and facilitates rapid electron transfer.
ISSN:2046-2069