Creating Single-Crystalline β-CaSiO 3 for High-Performance Dielectric Packaging Substrate

Creating Single-Crystalline β-CaSiO 3 for High-Performance Dielectric Packaging Substrate

β-CaSiO based glass-ceramics are among the most reliable materials for electronic packaging. However, developing a CaSiO glass-ceramic substrate with both high strength (>230 MPa) and low dielectric constant (

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Veröffentlicht in:Advanced materials (Weinheim) 2024-12, p.e2414156
Hauptverfasser: Jia, Qingchao, Wang, Wenzhi, Zhang, Hujun, Chen, Chunyu, Li, Ao, Chen, Chen, Yu, Hang, Zhang, Liangzhu, Tao, Haizheng, Zeng, Huidan, Luo, Xiongke, Yue, Yuanzheng
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Sprache:eng
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Zusammenfassung:β-CaSiO based glass-ceramics are among the most reliable materials for electronic packaging. However, developing a CaSiO glass-ceramic substrate with both high strength (>230 MPa) and low dielectric constant (
ISSN:1521-4095
DOI:10.1002/adma.202414156