Recent progress in multi-resonance thermally activated delayed fluorescence emitters with an efficient reverse intersystem crossing process
Multi-resonance thermally activated delayed fluorescence (MR-TADF) emitters have become an active research topic at the forefront of organic light-emitting diodes (OLEDs) owing to their excellent photophysical properties such as high efficiency and narrow emission characteristics. However, MR-TADF m...
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Veröffentlicht in: | Chemical communications (Cambridge, England) England), 2024-01, Vol.6 (9), p.189-199 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Multi-resonance thermally activated delayed fluorescence (MR-TADF) emitters have become an active research topic at the forefront of organic light-emitting diodes (OLEDs) owing to their excellent photophysical properties such as high efficiency and narrow emission characteristics. However, MR-TADF materials always exhibit slow reverse intersystem crossing rates (
k
RISC
) due to the large energy gap and small spin-orbit coupling values between singlet and triplet excited states. In order to optimize the RISC process, strategies such as heavy-atom-integration, metal perturbation, π-conjugation extension and peripheral decoration of donor/acceptor units have been proposed to construct efficient MR-TADF materials for high-performance OLEDs. This article provides an overview of the recent progress in MR-TADF emitters with an efficient RISC process, focusing on the structure-activity relationship between the molecular structure, optoelectronic feature, and OLED performance. Finally, the potential challenges and future prospects of MR-TADF materials are discussed to gain a more comprehensive understanding of the opportunities for efficient narrowband OLEDs.
To improve the
k
RISC
of MR-TADF materials, heavy-atom integration, metal perturbation, π-conjugation extension and peripheral decoration of donor/acceptor units are summarized to illustrate relationship between molecular structure and photoelectric property. |
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ISSN: | 1359-7345 1364-548X |
DOI: | 10.1039/d3cc05460h |