Effects of pH Values and H 2 O 2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten
In order to obtain tungsten with great surface qualities and high polishing efficiency, a novel method of chemical enhanced shear dilatancy polishing (C-SDP) was proposed. The effects of pH values and H O concentrations on the polishing performance of tungsten C-SDP were studied. In addition, the co...
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Veröffentlicht in: | Micromachines (Basel) 2022-05, Vol.13 (5) |
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Hauptverfasser: | , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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