Effects of pH Values and H 2 O 2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten

In order to obtain tungsten with great surface qualities and high polishing efficiency, a novel method of chemical enhanced shear dilatancy polishing (C-SDP) was proposed. The effects of pH values and H O concentrations on the polishing performance of tungsten C-SDP were studied. In addition, the co...

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Veröffentlicht in:Micromachines (Basel) 2022-05, Vol.13 (5)
Hauptverfasser: Xu, Liang, Wang, Lin, Chen, Hongyu, Wang, Xu, Chen, Fangyuan, Lyu, Binghai, Hang, Wei, Zhao, Wenhong, Yuan, Julong
Format: Artikel
Sprache:eng
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Zusammenfassung:In order to obtain tungsten with great surface qualities and high polishing efficiency, a novel method of chemical enhanced shear dilatancy polishing (C-SDP) was proposed. The effects of pH values and H O concentrations on the polishing performance of tungsten C-SDP were studied. In addition, the corrosion behaviors of tungsten in solutions with different pH values and H O concentrations were analyzed by electrochemical experiments, and the valence states of elements on the tungsten surface were analyzed by XPS. The results showed that both pH values and H O concentrations had significant effects on tungsten C-SDP. With the pH values increasing from 7 to 12, the increased from 6.69 µm/h to 13.67 µm/h. The optimal surface quality was obtained at pH = 9, the surface roughness ( ) reached 2.35 nm, and the corresponding was 9.71 µm/h. The increased from 9.71 µm/h to 34.95 µm/h with the H O concentrations increasing from 0 to 2 vol.%. When the concentration of H O was 1 vol.%, the of tungsten reached the lowest value, which was 1.87 nm, and the was 26.46 µm/h. This reveals that C-SDP technology is a novel ultra-precision machining method that can achieve great surface qualities and polishing efficiency of tungsten.
ISSN:2072-666X
2072-666X