Oxygen etching of thick MoS2 films

Oxygen annealing of thick MoS 2 films results in randomly oriented and controllable triangular etched shapes, forming pits with uniform etching angles. These etching morphologies differ across the sample based on the defect sites situated on the basal plane surface, forming numerous features in diff...

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Veröffentlicht in:Chemical communications (Cambridge, England) England), 2014-10, Vol.5 (76), p.11226-11229
Hauptverfasser: Ionescu, Robert, George, Aaron, Ruiz, Isaac, Favors, Zachary, Mutlu, Zafer, Liu, Chueh, Ahmed, Kazi, Wu, Ryan, Jeong, Jong S, Zavala, Lauro, Mkhoyan, K. Andre, Ozkan, Mihri, Ozkan, Cengiz S
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container_issue 76
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container_title Chemical communications (Cambridge, England)
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creator Ionescu, Robert
George, Aaron
Ruiz, Isaac
Favors, Zachary
Mutlu, Zafer
Liu, Chueh
Ahmed, Kazi
Wu, Ryan
Jeong, Jong S
Zavala, Lauro
Mkhoyan, K. Andre
Ozkan, Mihri
Ozkan, Cengiz S
description Oxygen annealing of thick MoS 2 films results in randomly oriented and controllable triangular etched shapes, forming pits with uniform etching angles. These etching morphologies differ across the sample based on the defect sites situated on the basal plane surface, forming numerous features in different bulk sample thicknesses. Oxygen annealing of thick MoS 2 films results in randomly oriented and controllable triangular etched shapes, forming pits with uniform etching angles.
doi_str_mv 10.1039/c4cc03911d
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source Royal Society Of Chemistry Journals 2008-; Alma/SFX Local Collection
title Oxygen etching of thick MoS2 films
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