IO and logic testing of 3D ICs should happen before clips are assembled

IO and logic testing of 3D ICs should happen before clips are assembled

If they are not detected before the 3D device is assembled then it has 0.954 probability of being defect free. Out of the 10,000 3D devices, 1854 would be defective. With four die in each 3D device, that means that 7,420 die would be discarded. Ln other words, 5,420 good die would be thrown away. Th...

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Veröffentlicht in:Electronics Weekly 2012-02 (2496), p.14
1. Verfasser: Press, Ron
Format: Artikel
Sprache:eng
Schlagworte:
Design engineering
Integrated circuits
Interfaces
Logic
Packaging
Test methods
Three dimensional imaging
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Zusammenfassung:If they are not detected before the 3D device is assembled then it has 0.954 probability of being defect free. Out of the 10,000 3D devices, 1854 would be defective. With four die in each 3D device, that means that 7,420 die would be discarded. Ln other words, 5,420 good die would be thrown away. This is an unacceptable loss.
ISSN:0013-5224