Thermally speaking...faster, high-performance PCs raising the bar

Thermally speaking...faster, high-performance PCs raising the bar

Through low air resistance and symmetry the heat sink allows the air of the fan to flow from the top (pressurizing) or from the bottom (evacuating) with identical performance. This allows the thermal engineer to match the heat sink to the air flow characteristics of the chassis, which in some boxes...

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Bibliographische Detailangaben
Veröffentlicht in:ECN 2001-08, Vol.45 (9), p.13
Hauptverfasser: Stead, Kenneth T, Wotring, Blaine
Format: Artikel
Sprache:eng
Schlagworte:
Acoustics
Air flow
Aluminum
Cooling
Efficiency
Electrical engineering
Engineers
High performance systems
Noise
Personal computers
Power
Product design
Systems stability
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Beschreibung
Zusammenfassung:Through low air resistance and symmetry the heat sink allows the air of the fan to flow from the top (pressurizing) or from the bottom (evacuating) with identical performance. This allows the thermal engineer to match the heat sink to the air flow characteristics of the chassis, which in some boxes can result in lower internal temperatures. In addition to new designs, new heat sink materials are also being employed.
ISSN:1523-3081