TIN WHISKER Observations

TIN WHISKER Observations

FIGURE 14 provides a SEM image from the perspective of looking down from the top of a tin whisker along its length to the Sn-plated surface. In this image, a hole in the Sn -plating surface is seen where the tin whisker emerges from the tin plate. During the months and years of our experimentation,...

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Veröffentlicht in:Circuits Assembly 2009-11, Vol.20 (11), p.26
Hauptverfasser: Ogden, Robert R, Champaign, Robert F
Format: Artikel
Sprache:eng
Schlagworte:
Alternatives
Components industry
Experiments
Failure analysis
Investigations
Lead content
Plating
Reliability
Silicones
Studies
Tin
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Zusammenfassung:FIGURE 14 provides a SEM image from the perspective of looking down from the top of a tin whisker along its length to the Sn-plated surface. In this image, a hole in the Sn -plating surface is seen where the tin whisker emerges from the tin plate. During the months and years of our experimentation, as tin whisker growth progressed, we observed an increasing number of Sn-plating voids. These plating voids are areas of tin depletion that occur as the tin whiskers grow.
ISSN:1054-0407