Is SPI the Yield Improvement Tool We've Waited For?

Is SPI the Yield Improvement Tool We've Waited For?

As one engineering manager said, "Screen printer defects occur randomly without a regular pattern. The defect rate of SMT will significantly decrease if real-time monitoring and maintenance of the screen printer operation were possible." Paste printing characterization is critical to minim...

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Veröffentlicht in:Circuits Assembly 2007-04, Vol.18 (4), p.28
1. Verfasser: Holzmann, Matthew T
Format: Magazinearticle
Sprache:eng
Schlagworte:
Automotive parts
Defects
Electronics industry
Feedback
Inspections
Integrated circuits
Interferometry
Manufacturing
Optimization
Printed circuit boards
Production methods
Soldering
Topography
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description As one engineering manager said, "Screen printer defects occur randomly without a regular pattern. The defect rate of SMT will significantly decrease if real-time monitoring and maintenance of the screen printer operation were possible." Paste printing characterization is critical to minimizing repetitive defects.
format Magazinearticle
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source EBSCOhost Business Source Complete
subjects Automotive parts
Defects
Electronics industry
Feedback
Inspections
Integrated circuits
Interferometry
Manufacturing
Optimization
Printed circuit boards
Production methods
Soldering
Topography
title Is SPI the Yield Improvement Tool We've Waited For?
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