Is SPI the Yield Improvement Tool We've Waited For?

Is SPI the Yield Improvement Tool We've Waited For?

As one engineering manager said, "Screen printer defects occur randomly without a regular pattern. The defect rate of SMT will significantly decrease if real-time monitoring and maintenance of the screen printer operation were possible." Paste printing characterization is critical to minim...

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Veröffentlicht in:Circuits Assembly 2007-04, Vol.18 (4), p.28
1. Verfasser: Holzmann, Matthew T
Format: Magazinearticle
Sprache:eng
Schlagworte:
Automotive parts
Defects
Electronics industry
Feedback
Inspections
Integrated circuits
Interferometry
Manufacturing
Optimization
Printed circuit boards
Production methods
Soldering
Topography
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Beschreibung
Zusammenfassung:As one engineering manager said, "Screen printer defects occur randomly without a regular pattern. The defect rate of SMT will significantly decrease if real-time monitoring and maintenance of the screen printer operation were possible." Paste printing characterization is critical to minimizing repetitive defects.
ISSN:1054-0407