PTFE-based composites for high-speed digital designs

A review of polytetrafluoroethylene (PTFE) based composites for high-speed digital designs was presented. The composite serves as a prepreg and processes at FR-4 temperatures thereby simplifying fabrication and trimming cost. The microsections of the composites were shown of a 20-layer board using t...

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Veröffentlicht in:Printed Circuit Fabrication 2002-08, Vol.25 (8), p.36-41
Hauptverfasser: McCarthy, Thomas F, Wynants, David L, Normyle, Seth J, Reveal, James E, Nurmi, Robert B, Rafferty, Kevin, Tripi, Joe
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Sprache:eng
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Zusammenfassung:A review of polytetrafluoroethylene (PTFE) based composites for high-speed digital designs was presented. The composite serves as a prepreg and processes at FR-4 temperatures thereby simplifying fabrication and trimming cost. The microsections of the composites were shown of a 20-layer board using the novel composite as the fill layers in a foil lamination. Results showed no evidence of land separation, barrel cracking or copper lifting in the composite.
ISSN:0274-8096