PTFE-based composites for high-speed digital designs
A review of polytetrafluoroethylene (PTFE) based composites for high-speed digital designs was presented. The composite serves as a prepreg and processes at FR-4 temperatures thereby simplifying fabrication and trimming cost. The microsections of the composites were shown of a 20-layer board using t...
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Veröffentlicht in: | Printed Circuit Fabrication 2002-08, Vol.25 (8), p.36-41 |
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Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | A review of polytetrafluoroethylene (PTFE) based composites for high-speed digital designs was presented. The composite serves as a prepreg and processes at FR-4 temperatures thereby simplifying fabrication and trimming cost. The microsections of the composites were shown of a 20-layer board using the novel composite as the fill layers in a foil lamination. Results showed no evidence of land separation, barrel cracking or copper lifting in the composite. |
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ISSN: | 0274-8096 |