Elimination of Immersion Silver Plating Defects

Elimination of Immersion Silver Plating Defects

Silver deposition is the function of the remaining three steps: predip, immersion silver plating, and a final DI water rinse. The purpose of the predip is threefold, starting with its function as a sacrificial solution to prevent contamination of the silver bath by drag-in of copper and other foreig...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:CircuiTree 2006-11, Vol.19 (11), p.10
Hauptverfasser: Ormerod, David, Yau, Yung Herng, Wynshenk, Jo
Format: Magazinearticle
Sprache:eng
Schlagworte:
Copper
Defects
Etching
Failure
Optimization
Plating
Polls & surveys
Printed circuit boards
Silver
Studies
Sulfur
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue 11
container_start_page 10
container_title CircuiTree
container_volume 19
creator Ormerod, David
Yau, Yung Herng
Wynshenk, Jo
description Silver deposition is the function of the remaining three steps: predip, immersion silver plating, and a final DI water rinse. The purpose of the predip is threefold, starting with its function as a sacrificial solution to prevent contamination of the silver bath by drag-in of copper and other foreign materials from the microctching operation.
format Magazinearticle
fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_reports_209795869</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>35242342</sourcerecordid><originalsourceid>FETCH-LOGICAL-p889-f69a077f49445d10ac80528c70f7db11d2f90b656591eb16918925bad63816693</originalsourceid><addsrcrecordid>eNqFjE1LxDAURbNQcBz9D3XjrpiX77eUcdSBAQVn4a6kbSKRtKlJx9_vqLNyI1y4XM7hnpAFUIm1Efz1jJyX8k4pcAFiQW7WMQxhtHNIY5V8tRkGl8v3eAnx0-XqOR7Y-FbdOe-6uVyQU29jcZfHXpLd_Xq3eqy3Tw-b1e22nozB2iu0VGsvUAjZA7WdoZKZTlOv-xagZx5pq6SSCK4FhWCQydb2ihtQCvmSXP3eTjl97F2Zm-ymlOfSMIoapflxrv84Qyidi9GOLu1LwyUTjB_yn8hQAFNg-BeA51aq</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>magazinearticle</recordtype><pqid>209795869</pqid></control><display><type>magazinearticle</type><title>Elimination of Immersion Silver Plating Defects</title><source>ProQuest Central UK/Ireland</source><creator>Ormerod, David ; Yau, Yung Herng ; Wynshenk, Jo</creator><creatorcontrib>Ormerod, David ; Yau, Yung Herng ; Wynshenk, Jo</creatorcontrib><description>Silver deposition is the function of the remaining three steps: predip, immersion silver plating, and a final DI water rinse. The purpose of the predip is threefold, starting with its function as a sacrificial solution to prevent contamination of the silver bath by drag-in of copper and other foreign materials from the microctching operation.</description><identifier>ISSN: 1059-843X</identifier><language>eng</language><publisher>Troy: BNP Media</publisher><subject>Copper ; Defects ; Etching ; Failure ; Optimization ; Plating ; Polls &amp; surveys ; Printed circuit boards ; Silver ; Studies ; Sulfur</subject><ispartof>CircuiTree, 2006-11, Vol.19 (11), p.10</ispartof><rights>Copyright BNP Media Nov 2006</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.proquest.com/docview/209795869?pq-origsite=primo$$EHTML$$P50$$Gproquest$$H</linktohtml><link.rule.ids>312,780,784,791,64387,64388,64393,72469</link.rule.ids></links><search><creatorcontrib>Ormerod, David</creatorcontrib><creatorcontrib>Yau, Yung Herng</creatorcontrib><creatorcontrib>Wynshenk, Jo</creatorcontrib><title>Elimination of Immersion Silver Plating Defects</title><title>CircuiTree</title><description>Silver deposition is the function of the remaining three steps: predip, immersion silver plating, and a final DI water rinse. The purpose of the predip is threefold, starting with its function as a sacrificial solution to prevent contamination of the silver bath by drag-in of copper and other foreign materials from the microctching operation.</description><subject>Copper</subject><subject>Defects</subject><subject>Etching</subject><subject>Failure</subject><subject>Optimization</subject><subject>Plating</subject><subject>Polls &amp; surveys</subject><subject>Printed circuit boards</subject><subject>Silver</subject><subject>Studies</subject><subject>Sulfur</subject><issn>1059-843X</issn><fulltext>true</fulltext><rsrctype>magazinearticle</rsrctype><creationdate>2006</creationdate><recordtype>magazinearticle</recordtype><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNqFjE1LxDAURbNQcBz9D3XjrpiX77eUcdSBAQVn4a6kbSKRtKlJx9_vqLNyI1y4XM7hnpAFUIm1Efz1jJyX8k4pcAFiQW7WMQxhtHNIY5V8tRkGl8v3eAnx0-XqOR7Y-FbdOe-6uVyQU29jcZfHXpLd_Xq3eqy3Tw-b1e22nozB2iu0VGsvUAjZA7WdoZKZTlOv-xagZx5pq6SSCK4FhWCQydb2ihtQCvmSXP3eTjl97F2Zm-ymlOfSMIoapflxrv84Qyidi9GOLu1LwyUTjB_yn8hQAFNg-BeA51aq</recordid><startdate>20061101</startdate><enddate>20061101</enddate><creator>Ormerod, David</creator><creator>Yau, Yung Herng</creator><creator>Wynshenk, Jo</creator><general>BNP Media</general><scope>7SP</scope><scope>7TA</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope><scope>0U~</scope><scope>1-H</scope><scope>3V.</scope><scope>7WY</scope><scope>7XB</scope><scope>883</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8FL</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>FRNLG</scope><scope>HCIFZ</scope><scope>K60</scope><scope>K6~</scope><scope>L.-</scope><scope>L.0</scope><scope>M0F</scope><scope>P5Z</scope><scope>P62</scope><scope>PQBIZ</scope><scope>PQBZA</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20061101</creationdate><title>Elimination of Immersion Silver Plating Defects</title><author>Ormerod, David ; Yau, Yung Herng ; Wynshenk, Jo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p889-f69a077f49445d10ac80528c70f7db11d2f90b656591eb16918925bad63816693</frbrgroupid><rsrctype>magazinearticle</rsrctype><prefilter>magazinearticle</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Copper</topic><topic>Defects</topic><topic>Etching</topic><topic>Failure</topic><topic>Optimization</topic><topic>Plating</topic><topic>Polls &amp; surveys</topic><topic>Printed circuit boards</topic><topic>Silver</topic><topic>Studies</topic><topic>Sulfur</topic><toplevel>online_resources</toplevel><creatorcontrib>Ormerod, David</creatorcontrib><creatorcontrib>Yau, Yung Herng</creatorcontrib><creatorcontrib>Wynshenk, Jo</creatorcontrib><collection>Electronics &amp; Communications Abstracts</collection><collection>Materials Business File</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Global News &amp; ABI/Inform Professional</collection><collection>Trade PRO</collection><collection>ProQuest Central (Corporate)</collection><collection>Access via ABI/INFORM (ProQuest)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>ABI/INFORM Trade &amp; Industry (Alumni Edition)</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>ABI/INFORM Collection (Alumni Edition)</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>Business Premium Collection (Alumni)</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Business Collection (Alumni Edition)</collection><collection>ProQuest Business Collection</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Professional Standard</collection><collection>ABI/INFORM Trade &amp; Industry</collection><collection>Advanced Technologies &amp; Aerospace Database</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Business (Alumni)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>CircuiTree</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ormerod, David</au><au>Yau, Yung Herng</au><au>Wynshenk, Jo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Elimination of Immersion Silver Plating Defects</atitle><jtitle>CircuiTree</jtitle><date>2006-11-01</date><risdate>2006</risdate><volume>19</volume><issue>11</issue><spage>10</spage><pages>10-</pages><issn>1059-843X</issn><abstract>Silver deposition is the function of the remaining three steps: predip, immersion silver plating, and a final DI water rinse. The purpose of the predip is threefold, starting with its function as a sacrificial solution to prevent contamination of the silver bath by drag-in of copper and other foreign materials from the microctching operation.</abstract><cop>Troy</cop><pub>BNP Media</pub></addata></record>
fulltext fulltext
identifier ISSN: 1059-843X
ispartof CircuiTree, 2006-11, Vol.19 (11), p.10
issn 1059-843X
language eng
recordid cdi_proquest_reports_209795869
source ProQuest Central UK/Ireland
subjects Copper
Defects
Etching
Failure
Optimization
Plating
Polls & surveys
Printed circuit boards
Silver
Studies
Sulfur
title Elimination of Immersion Silver Plating Defects
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T16%3A08%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Elimination%20of%20Immersion%20Silver%20Plating%20Defects&rft.jtitle=CircuiTree&rft.au=Ormerod,%20David&rft.date=2006-11-01&rft.volume=19&rft.issue=11&rft.spage=10&rft.pages=10-&rft.issn=1059-843X&rft_id=info:doi/&rft_dat=%3Cproquest%3E35242342%3C/proquest%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=209795869&rft_id=info:pmid/&rfr_iscdi=true