Elimination of Immersion Silver Plating Defects

Elimination of Immersion Silver Plating Defects

Silver deposition is the function of the remaining three steps: predip, immersion silver plating, and a final DI water rinse. The purpose of the predip is threefold, starting with its function as a sacrificial solution to prevent contamination of the silver bath by drag-in of copper and other foreig...

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Veröffentlicht in:CircuiTree 2006-11, Vol.19 (11), p.10
Hauptverfasser: Ormerod, David, Yau, Yung Herng, Wynshenk, Jo
Format: Magazinearticle
Sprache:eng
Schlagworte:
Copper
Defects
Etching
Failure
Optimization
Plating
Polls & surveys
Printed circuit boards
Silver
Studies
Sulfur
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Zusammenfassung:Silver deposition is the function of the remaining three steps: predip, immersion silver plating, and a final DI water rinse. The purpose of the predip is threefold, starting with its function as a sacrificial solution to prevent contamination of the silver bath by drag-in of copper and other foreign materials from the microctching operation.
ISSN:1059-843X