Next Generation Copper Based PCB Interconnection Technologies

Next Generation Copper Based PCB Interconnection Technologies

A follow-on interconnection technology to OTT is one based on a new IC package format having stair stepped layers called the SSP or stair stepped package. A key feature of the new structure is that it is possible to create a multilayer laminated IC package with a complete lack of plated through vias...

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Veröffentlicht in:CircuiTree 2005-11, Vol.18 (11), p.10
Hauptverfasser: Fjelstad, Joseph, Grundy, Kevin, Yasumura, Gary
Format: Artikel
Sprache:eng
Schlagworte:
Circuits
Copper
Design
Designers
Dielectric properties
Electronic design automation
Engineers
Interconnect
Manufacturing
Package design
Printed circuit boards
Production costs
Technological change
Technology
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Beschreibung
Zusammenfassung:A follow-on interconnection technology to OTT is one based on a new IC package format having stair stepped layers called the SSP or stair stepped package. A key feature of the new structure is that it is possible to create a multilayer laminated IC package with a complete lack of plated through vias. This new approach is aimed at simplifying electronic design and manufacturing processes, while simultaneously offering the potential for much improved electronic performance.
ISSN:1059-843X