Fine lines in high yield (Part LXXIX): Problems with residual, excess copper in print/etch and tent/etch processes (Part B)

This column is the second of a series on the subject of excess copper, and deals with defect causes related to lamination, exposure and phototooling. Article discusses lamination problems leading to excess copper, excess copper associated with improper exposure onditions, and excess copper due to phototool imperfections.