X-ray scattering from silicon surfaces
With the downscaling of integrated circuits, surface and interface roughness must be controlled to achieve those that are high-yielding. For roughness determination of high-quality surfaces and thickness control of ultrathin layers, some measurement equipment such as laser scattering, atomic force m...
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Veröffentlicht in: | Semiconductor international 1998-05, Vol.21 (5), p.81-86 |
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Hauptverfasser: | , , , , |
Format: | Magazinearticle |
Sprache: | eng |
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Online-Zugang: | Volltext |
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