SiPs enable new network processors

SiPs enable new network processors

Consequently, designers in communications applications are turning to new types of system-level integration based on modular approaches and high density interconnect (HDI). A new generation of system-level packaging called "system-in-- package" (SiP) combines multiple ICs and associated di...

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Veröffentlicht in:Electronic Engineering Times 2000-10 (1136), p.84
1. Verfasser: Sherman, Dave
Format: Artikel
Sprache:eng
Schlagworte:
Bandwidths
Designers
Flexibility
Integrated circuits
Intellectual property
Internet
Logic
Manufacturing
Packaging
Software
Systems design
Technological change
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Zusammenfassung:Consequently, designers in communications applications are turning to new types of system-level integration based on modular approaches and high density interconnect (HDI). A new generation of system-level packaging called "system-in-- package" (SiP) combines multiple ICs and associated discrete elements into a single component. This approach ensures the flexibility that designers require for isolated function upgrades, as well as reduces design and manufacturing complexity.
ISSN:0192-1541