Contacts on high aspect ratio 3D structures

We present a novel way for depositing material on the top surface of three-dimensional (3D) structures. This process supplies the possibility of applying a wide range of materials on the top of structures which are too high to be processed with conventional techniques. A planarization process or ver...

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Veröffentlicht in:	Microelectronic engineering 2011-11, Vol.88 (11), p.3224-3226
Hauptverfasser:	Neumann, R., Al-Suleiman, M., Erenburg, M., Ledig, J., Wehmann, H.-H., Waag, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Contacts Deposition Electronics Exact sciences and technology High aspect ratio Interfaces Microelectronic fabrication (materials and surfaces technology) Microelectronics Planarization Processing Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Three dimensional
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