Contacts on high aspect ratio 3D structures

Contacts on high aspect ratio 3D structures

We present a novel way for depositing material on the top surface of three-dimensional (3D) structures. This process supplies the possibility of applying a wide range of materials on the top of structures which are too high to be processed with conventional techniques. A planarization process or ver...

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Veröffentlicht in:Microelectronic engineering 2011-11, Vol.88 (11), p.3224-3226
Hauptverfasser: Neumann, R., Al-Suleiman, M., Erenburg, M., Ledig, J., Wehmann, H.-H., Waag, A.
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Contacts
Deposition
Electronics
Exact sciences and technology
High aspect ratio
Interfaces
Microelectronic fabrication (materials and surfaces technology)
Microelectronics
Planarization
Processing
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Three dimensional
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Beschreibung
Zusammenfassung:We present a novel way for depositing material on the top surface of three-dimensional (3D) structures. This process supplies the possibility of applying a wide range of materials on the top of structures which are too high to be processed with conventional techniques. A planarization process or vertical sidewalls of the structures are not necessary.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2011.09.002