Effect of thermal curing on the properties of thin films based on benzophenonetetracarboxylic dianhydride and 4,4′-diamino-3,3′-dimethyldiphenylmethane

The processing of polyimide films from polyamidic acid solutions involves the simultaeous loss of solvent and chemical conversion, and may imply structural reorganization such as orientation or crystallization. The effect of thermal treatment on the thermal, mechanical and dielectric properties of p...

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Veröffentlicht in:	Journal of thermal analysis and calorimetry 2011-06, Vol.104 (3), p.1135-1143
Hauptverfasser:	Sava, Ion, Chişcă, Ştefan, Brumă, Maria, Lisa, Gabriela
Format:	Artikel
Sprache:	eng
Schlagworte:	Analytical Chemistry Applied sciences Calorimetry Chemical properties Chemistry Chemistry and Materials Science Contact Contact angle Curing Dianhydrides Dielectric constant Dielectric films Dielectric properties Dielectrics Electric properties Electrical conductivity Exact sciences and technology Inorganic Chemistry Measurement Science and Instrumentation Mechanical analysis Mechanical properties Physical Chemistry Polymer industry, paints, wood Polymer Sciences Properties and testing Technology of polymers Thin films
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