Effect of thermal curing on the properties of thin films based on benzophenonetetracarboxylic dianhydride and 4,4′-diamino-3,3′-dimethyldiphenylmethane

The processing of polyimide films from polyamidic acid solutions involves the simultaeous loss of solvent and chemical conversion, and may imply structural reorganization such as orientation or crystallization. The effect of thermal treatment on the thermal, mechanical and dielectric properties of polymer films based on benzophenonetetracarboxylic dianhydride and 4,4’-diamino-3,3’-dimethyl diphenylmethane have been investigated. The thermal treatment of polyamidic acid at different temperatures led to compounds with different degree of imidization; it turned out that the imidization process took place with high speed until 240 °C and then remained constant. The dynamic mechanical analysis (DMA), contact angles, and dielectric measurements revealed that the storage modulus and contact angles increased with increasing of curing temperature while the dielectric constant decreased.