Interfacial reactions between Sn-3.5 Ag solder and Ni–W alloy films

Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni–W alloy films and Sn-3.5 Ag solder have been investigated. Ni–W alloys films with tungsten content in the r...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2011-09, Vol.22 (9), p.1372-1377
Hauptverfasser:	Haseeb, A. S. M. A., Chew, C. S., Johan, Mohd Rafie
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Copper Copper base alloys Cross-disciplinary physics: materials science rheology Design. Technologies. Operation analysis. Testing Diffusion interface formation Electrodeposition, electroplating Electronics Exact sciences and technology Integrated circuits Interface reactions Intermetallic compounds Joining, thermal cutting: metallurgical aspects Materials Science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Nickel Nickel base alloys Optical and Electronic Materials Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silver Solders Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Tin
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