Silver-Based Intermetallic Heterostructures in Sb2Te3 Thick Films with Enhanced Thermoelectric Power Factors

Silver-Based Intermetallic Heterostructures in Sb2Te3 Thick Films with Enhanced Thermoelectric Power Factors

In this work, Ag x Te y -Sb2Te3 heterostructured films are prepared by ligand exchange using hydrazine soluble metal chalcogenide. Because of the created interfacial barrier, cold carriers are more strongly scattered than hot ones and thereby an over 50% enhanced thermoelectric power factor (∼2 μW/(...

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Veröffentlicht in:Nano Lett 2012-02, Vol.12 (2), p.1075-1080
Hauptverfasser: Zhang, Yichi, Snedaker, Matthew L, Birkel, Christina S, Mubeen, Syed, Ji, Xiulei, Shi, Yifeng, Liu, Deyu, Liu, Xiaonao, Moskovits, Martin, Stucky, Galen D
Format: Artikel
Sprache:eng
Schlagworte:
Antimony - chemistry
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Conductivity phenomena in semiconductors and insulators
Electricity
Electronic transport in condensed matter
Exact sciences and technology
Membranes, Artificial
Metal Nanoparticles - chemistry
Particle Size
Physics
Silver - chemistry
solar (photovoltaic), solid state lighting, phonons, thermoelectric, bio-inspired, energy storage (including batteries and capacitors), electrodes - solar, defects, charge transport, materials and chemistry by design, optics, synthesis (novel materials), synthesis (self-assembly), synthesis (scalable processing)
Surface Properties
Tellurium - chemistry
Temperature
Thermoelectric and thermomagnetic effects
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Beschreibung
Zusammenfassung:In this work, Ag x Te y -Sb2Te3 heterostructured films are prepared by ligand exchange using hydrazine soluble metal chalcogenide. Because of the created interfacial barrier, cold carriers are more strongly scattered than hot ones and thereby an over 50% enhanced thermoelectric power factor (∼2 μW/(cm·K2)) is obtained at 150 °C. This shows the possibility of engineering multiphases to further improve thermoelectric performance beyond phonon scattering through a low-temperature solution processed route.
ISSN:1530-6984
1530-6992
DOI:10.1021/nl204346g