Design and construction of an optoelectronic crossbar switch containing a terabit per second free-space optical interconnect

The completed detailed design and initial phases of construction of an optoelectronic crossbar demonstrator are presented. The experimental system uses hybrid very large scale integrated optoelectronics technology whereby InGaAs-based detectors and modulators are flip-chip bonded onto silicon integr...

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Veröffentlicht in:	IEEE journal of selected topics in quantum electronics 1999-03, Vol.5 (2), p.236-249
Hauptverfasser:	Walker, A.C., Desmulliez, M.P.Y., Forbes, M.G., Fancey, S.J., Buller, G.S., Taghizadeh, M.R., Dines, J.A.B., Stanley, C.R., Pennelli, G., Boyd, A.R., Horan, P., Byrne, D., Hegarty, J., Eitel, S., Gauggel, H.-P., Gulden, K.-H., Gauthier, A., Benabes, P., Gutzwiller, J.-L., Goetz, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aggregates Bonding Construction Design engineering Detectors Hybrid integrated circuits Integrated circuit technology Integrated optoelectronics Modulators Optical modulation Optoelectronics Phases Silicon Switches Very large scale Very large scale integration
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Beschreibung
Zusammenfassung:	The completed detailed design and initial phases of construction of an optoelectronic crossbar demonstrator are presented. The experimental system uses hybrid very large scale integrated optoelectronics technology whereby InGaAs-based detectors and modulators are flip-chip bonded onto silicon integrated circuits. The system aims to demonstrate a 1-Tb/s aggregate data input/output to a single chip by means of free-space optics.
ISSN:	1077-260X 1558-4542
DOI:	10.1109/2944.778297