In situ-doped amorphous Si sub(0.8)C sub(0.2) emitter bipolar transistors

The fabrication and characterization of in situ-doped amorphous Si sub(0.8)C sub(0.2) emitter transistors are presented. Emitter Gummel numbers exceeding 10 super(14) s/cm super(4) are reported for the first time in this type of structure. The high values obtained for G sub(E) are believed to be due...

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Veröffentlicht in:IEEE electron device letters 1999-11, Vol.20 (11), p.592-594
Hauptverfasser: Orpella, A, Bardes, D, Alcubilla, R, Marsal, L F, Pallares, J
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container_issue 11
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creator Orpella, A
Bardes, D
Alcubilla, R
Marsal, L F
Pallares, J
description The fabrication and characterization of in situ-doped amorphous Si sub(0.8)C sub(0.2) emitter transistors are presented. Emitter Gummel numbers exceeding 10 super(14) s/cm super(4) are reported for the first time in this type of structure. The high values obtained for G sub(E) are believed to be due to the valance band discontinuity between the Si sub(0.8)C sub(0.2) layer and the crystalline part of the emitter, which effectively blocks the minority carrier injection from the base into the noncrystalline part of the emitter.
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subjects Crystal structure
Devices
Discontinuity
Emittance
Emitters (electron)
Germanium
Minority carriers
Semiconductor devices
title In situ-doped amorphous Si sub(0.8)C sub(0.2) emitter bipolar transistors
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