Corrosion behaviour of copper under chloride-containing thin electrolyte layer
► Corrosion behaviour of copper under thin electrolyte layers (TEL) with various thicknesses was investigated. ► Corrosion rate increases with decreasing layer thickness during the initial stage. ► Corrosion rate follows the order 300 > 402 > 199 > bulk solution > 101 μm after long time...
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| Veröffentlicht in: | Corrosion science 2011-10, Vol.53 (10), p.3289-3298 |
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| container_title | Corrosion science |
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| creator | Liao, Xiaoning Cao, Fahe Zheng, Liyun Liu, Wenjuan Chen, Anna Zhang, Jianqing Cao, Chunan |
| description | ► Corrosion behaviour of copper under thin electrolyte layers (TEL) with various thicknesses was investigated. ► Corrosion rate increases with decreasing layer thickness during the initial stage. ► Corrosion rate follows the order 300
>
402
>
199
>
bulk solution
>
101
μm after long time immersion. ► A corrosion model of copper under chloride-containing TEL is proposed.
The corrosion behaviour of copper under chloride-containing thin electrolyte layers (TEL) was investigated using electrochemical impedance spectroscopy (EIS), cathodic polarization, linear polarization, SEM/EDS and XRD. The results indicate that the copper corrosion rate increases as TEL thickness decreases during the initial stages. After 192
h of immersion, the corrosion rate of copper under TEL in this order: 300
>
402
>
199
>
bulk solution
>
101
μm. The corrosion behaviour is uniform under TEL, and pitting is the primary corrosion type in the bulk solution. A corrosion model of the behaviour of copper under chloride-containing TEL is proposed. |
| doi_str_mv | 10.1016/j.corsci.2011.06.004 |
| format | Article |
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>
402
>
199
>
bulk solution
>
101
μm after long time immersion. ► A corrosion model of copper under chloride-containing TEL is proposed.
The corrosion behaviour of copper under chloride-containing thin electrolyte layers (TEL) was investigated using electrochemical impedance spectroscopy (EIS), cathodic polarization, linear polarization, SEM/EDS and XRD. The results indicate that the copper corrosion rate increases as TEL thickness decreases during the initial stages. After 192
h of immersion, the corrosion rate of copper under TEL in this order: 300
>
402
>
199
>
bulk solution
>
101
μm. The corrosion behaviour is uniform under TEL, and pitting is the primary corrosion type in the bulk solution. A corrosion model of the behaviour of copper under chloride-containing TEL is proposed.</description><identifier>ISSN: 0010-938X</identifier><identifier>EISSN: 1879-0496</identifier><identifier>DOI: 10.1016/j.corsci.2011.06.004</identifier><identifier>CODEN: CRRSAA</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>A. Copper ; Applied sciences ; B. EIS ; B. Polarization ; C. Atmospheric corrosion ; CATHODES ; CHLORIDES ; Copper ; CORROSION ; Corrosion environments ; Corrosion rate ; Electrochemical impedance spectroscopy ; Electrolytes ; Exact sciences and technology ; Metals. Metallurgy ; Pitting (corrosion) ; THIN FILMS</subject><ispartof>Corrosion science, 2011-10, Vol.53 (10), p.3289-3298</ispartof><rights>2011 Elsevier Ltd</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c368t-c21b1b83e7263982115b5db3fe159b41633d4176b5dbb18b4fd414501908d8e03</citedby><cites>FETCH-LOGICAL-c368t-c21b1b83e7263982115b5db3fe159b41633d4176b5dbb18b4fd414501908d8e03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.corsci.2011.06.004$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>315,782,786,3554,27933,27934,46004</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=24420668$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Liao, Xiaoning</creatorcontrib><creatorcontrib>Cao, Fahe</creatorcontrib><creatorcontrib>Zheng, Liyun</creatorcontrib><creatorcontrib>Liu, Wenjuan</creatorcontrib><creatorcontrib>Chen, Anna</creatorcontrib><creatorcontrib>Zhang, Jianqing</creatorcontrib><creatorcontrib>Cao, Chunan</creatorcontrib><title>Corrosion behaviour of copper under chloride-containing thin electrolyte layer</title><title>Corrosion science</title><description>► Corrosion behaviour of copper under thin electrolyte layers (TEL) with various thicknesses was investigated. ► Corrosion rate increases with decreasing layer thickness during the initial stage. ► Corrosion rate follows the order 300
>
402
>
199
>
bulk solution
>
101
μm after long time immersion. ► A corrosion model of copper under chloride-containing TEL is proposed.
The corrosion behaviour of copper under chloride-containing thin electrolyte layers (TEL) was investigated using electrochemical impedance spectroscopy (EIS), cathodic polarization, linear polarization, SEM/EDS and XRD. The results indicate that the copper corrosion rate increases as TEL thickness decreases during the initial stages. After 192
h of immersion, the corrosion rate of copper under TEL in this order: 300
>
402
>
199
>
bulk solution
>
101
μm. The corrosion behaviour is uniform under TEL, and pitting is the primary corrosion type in the bulk solution. A corrosion model of the behaviour of copper under chloride-containing TEL is proposed.</description><subject>A. Copper</subject><subject>Applied sciences</subject><subject>B. EIS</subject><subject>B. Polarization</subject><subject>C. Atmospheric corrosion</subject><subject>CATHODES</subject><subject>CHLORIDES</subject><subject>Copper</subject><subject>CORROSION</subject><subject>Corrosion environments</subject><subject>Corrosion rate</subject><subject>Electrochemical impedance spectroscopy</subject><subject>Electrolytes</subject><subject>Exact sciences and technology</subject><subject>Metals. Metallurgy</subject><subject>Pitting (corrosion)</subject><subject>THIN FILMS</subject><issn>0010-938X</issn><issn>1879-0496</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNp9kEtLAzEQgIMoWB__wMNexNOuM7tpmlwEKb6g6EXBW8hmZ23KmtRkK_Tfm1Lx6GWGGb6ZYT7GLhAqBBTXq8qGmKyrakCsQFQA_IBNUM5UCVyJQzYBQChVI9-P2UlKKwDILEzY8zzEGJILvmhpab5d2MQi9IUN6zXFYuO7HO1yCNF1VNrgR-O88x_FuHS-oIHsGMOwHakYzJbiGTvqzZDo_Defsrf7u9f5Y7l4eXia3y5K2wg5lrbGFlvZ0KwWjZI14rSddm3TE05Vy1E0TcdxJnbNFmXL-1zyKaAC2UmC5pRd7feuY_jaUBr1p0uWhsF4CpukFaqMSq4yyfekzW-mSL1eR_dp4lYj6J09vdJ7e3pnT4PQ2V4eu_w9YJI1Qx-Nty79zdac1yCEzNzNnqP87bejqPMm8pY6F7Mb3QX3_6Ef6b-Hqg</recordid><startdate>20111001</startdate><enddate>20111001</enddate><creator>Liao, Xiaoning</creator><creator>Cao, Fahe</creator><creator>Zheng, Liyun</creator><creator>Liu, Wenjuan</creator><creator>Chen, Anna</creator><creator>Zhang, Jianqing</creator><creator>Cao, Chunan</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SE</scope><scope>8BQ</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20111001</creationdate><title>Corrosion behaviour of copper under chloride-containing thin electrolyte layer</title><author>Liao, Xiaoning ; Cao, Fahe ; Zheng, Liyun ; Liu, Wenjuan ; Chen, Anna ; Zhang, Jianqing ; Cao, Chunan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c368t-c21b1b83e7263982115b5db3fe159b41633d4176b5dbb18b4fd414501908d8e03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>A. Copper</topic><topic>Applied sciences</topic><topic>B. EIS</topic><topic>B. Polarization</topic><topic>C. Atmospheric corrosion</topic><topic>CATHODES</topic><topic>CHLORIDES</topic><topic>Copper</topic><topic>CORROSION</topic><topic>Corrosion environments</topic><topic>Corrosion rate</topic><topic>Electrochemical impedance spectroscopy</topic><topic>Electrolytes</topic><topic>Exact sciences and technology</topic><topic>Metals. Metallurgy</topic><topic>Pitting (corrosion)</topic><topic>THIN FILMS</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Liao, Xiaoning</creatorcontrib><creatorcontrib>Cao, Fahe</creatorcontrib><creatorcontrib>Zheng, Liyun</creatorcontrib><creatorcontrib>Liu, Wenjuan</creatorcontrib><creatorcontrib>Chen, Anna</creatorcontrib><creatorcontrib>Zhang, Jianqing</creatorcontrib><creatorcontrib>Cao, Chunan</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Corrosion Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Corrosion science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Liao, Xiaoning</au><au>Cao, Fahe</au><au>Zheng, Liyun</au><au>Liu, Wenjuan</au><au>Chen, Anna</au><au>Zhang, Jianqing</au><au>Cao, Chunan</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Corrosion behaviour of copper under chloride-containing thin electrolyte layer</atitle><jtitle>Corrosion science</jtitle><date>2011-10-01</date><risdate>2011</risdate><volume>53</volume><issue>10</issue><spage>3289</spage><epage>3298</epage><pages>3289-3298</pages><issn>0010-938X</issn><eissn>1879-0496</eissn><coden>CRRSAA</coden><abstract>► Corrosion behaviour of copper under thin electrolyte layers (TEL) with various thicknesses was investigated. ► Corrosion rate increases with decreasing layer thickness during the initial stage. ► Corrosion rate follows the order 300
>
402
>
199
>
bulk solution
>
101
μm after long time immersion. ► A corrosion model of copper under chloride-containing TEL is proposed.
The corrosion behaviour of copper under chloride-containing thin electrolyte layers (TEL) was investigated using electrochemical impedance spectroscopy (EIS), cathodic polarization, linear polarization, SEM/EDS and XRD. The results indicate that the copper corrosion rate increases as TEL thickness decreases during the initial stages. After 192
h of immersion, the corrosion rate of copper under TEL in this order: 300
>
402
>
199
>
bulk solution
>
101
μm. The corrosion behaviour is uniform under TEL, and pitting is the primary corrosion type in the bulk solution. A corrosion model of the behaviour of copper under chloride-containing TEL is proposed.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.corsci.2011.06.004</doi><tpages>10</tpages></addata></record> |
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| ispartof | Corrosion science, 2011-10, Vol.53 (10), p.3289-3298 |
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| language | eng |
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| source | Access via ScienceDirect (Elsevier) |
| subjects | A. Copper Applied sciences B. EIS B. Polarization C. Atmospheric corrosion CATHODES CHLORIDES Copper CORROSION Corrosion environments Corrosion rate Electrochemical impedance spectroscopy Electrolytes Exact sciences and technology Metals. Metallurgy Pitting (corrosion) THIN FILMS |
| title | Corrosion behaviour of copper under chloride-containing thin electrolyte layer |
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