Multichip module photovoltaic miniarrays

In this work a novel concept of photovoltaic mini array assembly is described based on a flip-chip multichip module technology. A number of arrays composed of 15 series-connected 2 mm/sup 2/ c-Si photovoltaic cells have been fabricated, achieving a packaging density of 40 cells/cm/sup 2/. Measuremen...

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Veröffentlicht in:IEEE transactions on advanced packaging 2001-05, Vol.24 (2), p.169-174
Hauptverfasser: Ortego, P.R., Bermejo, S., Castaner, L.M.
Format: Artikel
Sprache:eng
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Zusammenfassung:In this work a novel concept of photovoltaic mini array assembly is described based on a flip-chip multichip module technology. A number of arrays composed of 15 series-connected 2 mm/sup 2/ c-Si photovoltaic cells have been fabricated, achieving a packaging density of 40 cells/cm/sup 2/. Measurements of the dark I-V characteristic confirmed that the resistive losses of the approach are small and do not degrade the electrical characteristics of the array. Nearly 0.5 mW/cm/sup 2/ delivered density power, and 7 V in open circuit conditions were typically measured under normalized solar spectrum (AM1.5 100 mW/cm/sup 2/), and around 6.3 mW/cm/sup 2/ and 8.5 V using a 150 W commercial lamp placed at 5 cm distance from the panel.
ISSN:1521-3323
1557-9980
DOI:10.1109/6040.928751