Dissolution kinetics and diffusivity of silver in glassy layers for hybrid microelectronics

Silver and palladium/silver compositions are widely used in hybrid microelectronics, as electrodes for dielectric layers and multilayers, terminations of thick film resistors and interconnections. Interactions between Ag and the adjacent films are known to affect the microcircuit performances. The present study is aimed at collecting data on the behavior of Ag-based films in contact with glassy layers. Most experiments were performed with a glass with composition 68.2 PbO : 30.5 SiO^sub 2^ : 1.3 Al^sub 2^O^sub 3^ wt %. Two different systems were analyzed. The first system consists of thick films prepared from a paste containing glass and either 3 or 15 wt % silver particles; both fine (spherical grains, 0.5-1 μm diameter) and coarse (flakes, 2-5 μm,