Fabrication of NdFeB microstructures using a silicon molding technique for NdFeB/Ta multilayered films and NdFeB magnetic powder
The silicon molding technique is described for patterning of NdFeB/Ta multilayered magnetic films and NdFeB magnetic powder at the micron scale. Silicon trenches are seamlessly filled by 12-μm-thick NdFeB/Ta multilayered magnetic films with a magnetic retentivity of 1.3 T. The topography image and m...
Gespeichert in:
Veröffentlicht in: | Journal of magnetism and magnetic materials 2011-11, Vol.323 (21), p.2696-2700 |
---|---|
Hauptverfasser: | , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The silicon molding technique is described for patterning of NdFeB/Ta multilayered magnetic films and NdFeB magnetic powder at the micron scale. Silicon trenches are seamlessly filled by 12-μm-thick NdFeB/Ta multilayered magnetic films with a magnetic retentivity of 1.3
T. The topography image and magnetic field distribution image are measured using an atomic force microscope and a magnetic force microscope, respectively. Using a silicon molding technique complemented by a lift-off process, NdFeB magnetic powder is utilized to fabricate magnetic microstructures. Silicon trenches as narrow as 20
μm are filled by a mixture of magnetic powder and wax powder. The B–H hysteresis loop of the patterned magnetic powder is characterized using a vibrating sample magnetometer, which shows a magnetic retentivity of approximately 0.37
T.
► We demonstrate the fabrication of micro-magnets using silicon molding processes. ► NdFeB/Ta films are well filled in silicon trenches with a thickness of 12
μm. ► The 12-μm-thick NdFeB/Ta magnetic film shows a retentivity of 1.3
T. ► Magnetic structures as narrow as 20
μm are fabricated using NdFeB magnetic powder. ► VSM measurement shows a retentivity of 0.37
T for patterned NdFeB magnetic powder. |
---|---|
ISSN: | 0304-8853 |
DOI: | 10.1016/j.jmmm.2011.05.061 |