Lithographyless ion implantation technology for agile fab

A new type of ion implanter developed for an agile fab can eliminate the processes concerned. with photoresist lithography from the ion implantation process. This new ion implantation technology can reduce the raw process time, footprint, and the cost of ownership to less than one-half that of conve...

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Veröffentlicht in:	IEEE transactions on semiconductor manufacturing 2002-11, Vol.15 (4), p.464-469
Hauptverfasser:	Nishihashi, T., Kashimoto, K., Fujiyama, J., Sakurada, Y., Shibata, T., Suguro, K., Sugihara, K., Okumura, K., Gotou, T., Saji, N., Tsunoda, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Agile manufacturing Applied sciences Biomembranes Cost engineering Costs Devices Electronics Electrostatics Exact sciences and technology Footprints Implants Ion beams Ion implantation Lithography Microelectronic fabrication (materials and surfaces technology) Ownership Photoresists Resists Semiconductor device manufacture Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors
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Beschreibung
Zusammenfassung:	A new type of ion implanter developed for an agile fab can eliminate the processes concerned. with photoresist lithography from the ion implantation process. This new ion implantation technology can reduce the raw process time, footprint, and the cost of ownership to less than one-half that of conventional ion implantation technology. The authors are making further developments on this ion implanter and evaluating technical issues related to ion implantation. This technique is suitable for manufacturing submicron node IC devices. Based on the results of evaluating the prototype machine, we will produce the next /spl beta/-machine.
ISSN:	0894-6507 1558-2345
DOI:	10.1109/TSM.2002.804923