Characterization of micromachined transitions for high-speed integrated packages

Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height...

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Veröffentlicht in:	IEEE transactions on antennas and propagation 2002-05, Vol.50 (5), p.693-697
Hauptverfasser:	Drayton, R.F., Banerjee, S.R., Haley, J.L.
Format:	Artikel
Sprache:	eng
Schlagworte:	Antennas Circuit synthesis Circuit testing Conductors Dielectric constant Dielectric substrates Discontinuity Dispersions High speed High speed integrated circuits Integrated circuit interconnections Micromachining Micromechanics Microstrip Noise levels Packaging
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