Characterization of micromachined transitions for high-speed integrated packages

Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height design, has better than 20 dB return loss over 40 GHz. Its effective dielectric constant variation is less than 0.25 dB across the bandwidth, which indicates a low dispersion interconnect design with a micromachined transition.