Enhanced electronic system reliability - challenges for temperature prediction

Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementatio...

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Veröffentlicht in:IEEE transactions on components and packaging technologies 2002-12, Vol.25 (4), p.533-538
Hauptverfasser: Parry, J.D., Rantala, J., Lasance, C.J.M.
Format: Artikel
Sprache:eng
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Zusammenfassung:Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement of reliability through better temperature-related information are described.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2002.808001