Electronic properties of n-ZnO(Al)/p-Si heterojunction prepared by dc magnetron sputtering

The electronic properties of the interface between p-type Si and Al-doped ZnO have been investigated. Films of ZnO(Al) with a thickness of 300 nm were deposited at room temperature by dc magnetron sputtering and subsequently subjected to heat treatment in air in the temperature range 100–400 °C. Current–voltage (I–V), capacitance–voltage (C–V) and deep level transient spectroscopy (DLTS) measurements were used to characterize the electrical properties of the heterostructure. The I–V measurements show a diode-like behavior with a rectification of ~ 3–4 orders of magnitude. However, annealing above 200 °C gives rise to a pronounced recombination/generation current in the depletion region, which correlates with an increase of the carrier concentration close to the interface and indicates defect formation. Indeed, DLTS reveals the presence of two prominent defect states, one at 0.38 eV above the valence band edge (E v ), and the other, formed during the heat treatment above 250 °C, around E v + 0.43 eV, which is consistent with the I–V and C–V data.