Preparation and properties of p-type transparent conductive Cu-doped NiO films
The NiO–Cu composite films with various Cu contents of 0–18.17 at.% are deposited on a glass substrate. An ultra high electrical resistivity (ρ) is obtained and cannot be detected by a four point probe measurement when the Cu content in the films is lower than 6.97 at.%. The ρ value is reduced signi...
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Veröffentlicht in: | Thin solid films 2011-05, Vol.519 (15), p.4944-4947 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The NiO–Cu composite films with various Cu contents of 0–18.17
at.% are deposited on a glass substrate. An ultra high electrical resistivity (ρ) is obtained and cannot be detected by a four point probe measurement when the Cu content in the films is lower than 6.97
at.%. The ρ value is reduced significantly to 35.8
Ω-cm as Cu content is increased to 9.18
at.%, and it further decreases to 0.02
Ω-cm when the Cu content further increases to 18.17
at.%. The Hall measurement for all Cu-doped NiO films shows p-type conduction. In addition, the transmittance of NiO films also decreases continuously from 96% to 43% as Cu content increases from 0 to 18.17
at.%. The XRD patterns of Cu-doped NiO films show that only NiO peaks appear and the crystallinity of NiO films degrades as Cu content exceeds 6.97
at.%. A large amount of lattice sites of Ni
2+ ions in a NiO crystallite is replaced by the Cu
+ ions that lead to p-type conduction and result in the degradation of crystallinity for NiO–Cu composite films that have a higher Cu content. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2011.01.058 |